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Research On Inorganic High Temperature Adhesives For Metals And Composite Constructions

Report Number: WADC TR 59-113 Part 3
Author: Johnston, Ova E.
Author: Robbins, W. Paul
Corporate Author: Aeronca Mfg Corp Middletown OH
Laboratory: Directorate of Materials and Processes
Date of Publication: 1962-05
Pages: 241
Contract: AF 33(616)-7196
Project: 7340
Task: 73401
AD Number: AD0282065

Research was conducted on high temperature inorganic non-polymeric adhesives for metal to metal bonding, for applications as high as the 2000 to 3000 F range. The following research was accomplished: fabrications and evaluation of experimental inorganic, non-polymeric adhesives; preparation and application of the inorganic adhesives to the metal adherends; improvement of flexibility, toughness, and strength of the adhesive to obtain a highly efficient bond for use in joining the high temperature resistant metals such as 17-7 PH, PH 15-7 Mo, AM-350, Inconel 'X'; processing research for optimum joining of honeycomb sandwich structures with inorganic adhesives; evaluation of bonded honeycomb panels for structural integrity and capability; and refractory metals inorganic adhesive bonded with retention of useful bond strength in the 1800 to 2000 F temperature range.

Lockheed Martin Missiles & Fire Control
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