Development Of A Heat-Resistant Foamed-In-Place Low-Density Silicon Resin Core Material
Report Number: WADC TR 53-146
Author: Hoffman, Kenneth R.
Author: Weyer, Donald E.
Corporate Author: Dow Corning Corporation
Laboratory: Materials Laboratory
Date of Publication: 1953-12
Pages: 111
Contract: AF 33 (600)-6320
Project: None Given
PB Number: PB111555
AD Number: AD0018295
Abstract: The abstract for this report is either unavailable or has yet to be entered
Provenance: IIT
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Via the Defense Technical Information Center (DTIC): This report is not publicly available via DTIC Via National Technical Information Service: This report is unlikely to be available in the National Technical Reports Library Indications of Public Availability A PB Number, PB111555 , exists for this report, indicating public availability of the report at time of publication An index contemporary to the publication of this report suggests its public availability This report has been indexed in U.S. Government Research Reports, vol. 23, no. 3, p.73, 3/18/1955 You may view this report's index entry There has been no verification of an indication of public availability from an inside cover statementRelated Reports
This report has the following supplements:
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Development Of A Heat-Resistant Foamed-In-Place Low-Density Silicone Resin Core Material
WADC TR 53-146 Supplement 1