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Development of Improved Solders for Electronic Reliability

Report Number: AFML TR 77-93
Author(s): M. C. Denlinger; R. W. Korb; V. F. Lardenoit
Corporate Author: Hughes Aircraft Company
Laboratory: Air Force Materials Laboratory
Date of Publication: 1977-06
Pages: 109
Contract: F33615-76-C-5089
Project: 7351 - Metallic Materials
AD Number: ADA046213

A higher temperature solder alloy intended for use on polyimide printed wiring boards was developed. The solder shows no evidence of cracking after exposure to 500 temperature cycles between 200 C and -55 C. A comparative test with Sn63 between 125 C and -55 C resulted in cracking after 200 cycles. The alloy (90Pb9Cd1Zn) was the result of selecting, testng and modifying all possible alloy systems that would be suitable for printed wiring board application. The resulting alloy, in addition to providing increased reliability, offers a significant cost reduction over the conventional tin-lead system.

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